Year

Event

1987

Commissioned by the Graduate School of the Chinese Academy of Sciences (CAS) to develop white light / laser annealing equipment.

1989

First Delivery of KST-02 RTP to the Institute of Low Energy Nuclear Physics, Beijing Normal University.

1990

First Delivery of RTP300 to the Institute of Semiconductors, CAS.

1993

Delivery of RTP300 to The Hong Kong Polytechnic University.

1997

First Delivery of RTP500 to the 13th Research Institute of CEC (China Electronics Corporation).

1999

Delivery of RTP500 to The Hong Kong Polytechnic University.

2003

First Delivery of RTP500V to Beijing Jiaotong University.

2003

Dongxing Design Office spun off from State-Owned Factory 706 to establish Beijing Dongzhixing Applied Physics Institute.

2004

First Delivery of RTP400 to the Institute of Microelectronics, Tsinghua University.

2005

Delivery of RTP300 to Youngstown State University, USA.

2006

Delivery of RTP500V to Nanyang Technological University, Singapore.

2007

Director He Lingyu retired; He Ning took over R&D and management.

2008

First Delivery of RTP500E to Qingdao University.

2009

First Delivery of RTP600 to the Institute of Microelectronics, CAS.

2011

First Delivery of RTPlugin to Sino-Micro Semiconductor Equipment Co., Ltd.

2011

Delivery of RTP300 to Beijing No.4 High School.

2012

Delivery of RTP300 to the University of Dundee, UK.

2013

First Delivery of RTP500V+ to the Institute of Microelectronics, CAS.

2014

First Delivery of RTP500VL to Shanghai Jiao Tong University.

2015

First Delivery of RTP600V+ Dual-Temperature Zone RTP to the Institute of Electrical Engineering, CAS.

2016

Partnered with Tsinghua University and Zhongsheng Optoelectronics to develop 12-inch MOCVD.

2017

Delivery of RTP500Z to enterprises including Hebei Guansen, Zhongke Guangxin, and Kunyuan Optoelectronics.

2019

Delivery of 6-inch RTP600Z to enterprises including Shandong Tianyue, Mingpu Magnetics, and Quanlei Optoelectronics.

2020

Delivery of 8-inch RTP800V to Shandong University and the Institute of Electrical Engineering, CAS.

2021

Delivery of Ultra-High Temperature RTP and RTP1700 to the Institute of Microelectronics, CAS.

2022

Participated in the research project to break the technological bottleneck of SMIC's 12-inch production line.

2023

Delivery of RTP800V Automated Loading System to the Institute of Microelectronics, CAS.